With the advent of large computing capability with high performance processors which is running round the clock, there is an ever increasing demand for high quality and cost effective thermal management in Electronic systems. Here in FlowXplore, we use the state-of-the-art simulation methodologies and employ design and analysis that can be addressed for emerging thermal challenges in Electronic Industry.
Fluid & Thermal analysis for circuit boards
We work in tandem with the clients, review their assessments, carry out feasibility studies and provide complete end-to-end cooling solutions. We address the air flow requirements, component placement and heat sink requirements. Our recommendations on design changes are solely from the analysis of power density, total space available and thermal load on the system.
System level analysis for data centres
FlowXplore provides a more scientific and comprehensive design approach to thermal and power management for Data centres. CFD technology can be applied to create a better understanding of flow path inside the centre and illustrate the effects of equipment layout, location of cooling unit, under-floor obstructions and temperature distribution inside the centre.
This would enable data centre mangers to accurately depict and understand the use of cooling resources and allow for appropriate infrastructure right-sizing. This could significantly help prevent organizations from under- or over-provisioning the infrastructure. Instead of buying cooling equipment they do not need, they might discover that they can simply reposition what they have.
Areas Served
1. Flow and thermal analysis for RADAR systems in defence containers.
2. Feasibility study and thermal analysis for cell phones.
3. CPU cooling.
4. Improving cooling effectiveness in data centres.
5. Automotive electronic cooling.
6. Flow/thermal analysis for PCB.
